Suitable for conducting high and low temperature, humidity and heat tests on electrical, electronic, mechanical and other products, components, materials, etc., simulating temperature and humidity changes to conduct quality and reliability tests on products, components, materials, etc.
GJBl50.9-2009 (MIL-STD-810D) Wet Heat Test Method;
GJB360.8-2009 (MIL-STD. 202F) High temperature life test;
GJBl50.3-2009 (MIL-STD-810D) High temperature test method;
GJBl50.4-2009 (MIL-STD-810D) Low temperature test method;
GB-2423.1-2008 (IEC68-2-1) Test A: Low temperature test method;
GB-2423.2-2008 (IEC68-2-2) Test B: High temperature test method;
GB2423.3-2008 (IEC68-2-3) Test Ca: Constant Damp Heat Test Method;
GB2423.4-2008 (IEC68-2-30) Test Db: Alternating Damp Heat Test Method.